Tantalum sputtering targets (Ta target, tantalum sputter target)
Grade : 3N, 3N5, 4N, 4N5 with Ta 99.95%min
Chemical composition :
Ta 99.95 %min
O 0.0100 %max
C 0.0040 %max
N 0.0040 %max
H 0.0010 %max
S 0.0001 %max
Al 0.0005 %max
Ca 0.0005 %max
Cd 0.0005 %max
Cl 0.0005 %max
Co 0.0005 %max
Cr 0.0005 %max
Cu 0.0005 %max
Fe 0.0005 %max
Hf 0.0005 %max
K 0.0001 %max
Li 0.0001 %max
Mg 0.0005 %max
Mn 0.0005 %max
Mo 0.0050 %max
Na 0.0001 %max
Nb 0.0400 %max
Ni 0.0005 %max
Pb 0.0005 %max
Si 0.0005 %max
Sn 0.0005 %max
Ti 0.0005 %max
Th 0.0050 %max
V 0.0005 %max
W 0.0150 %max
Zn 0.0005 %max
Zr 0.0005 %max
Y 0.0005 %max
U 0.0050 %max
Others (each) : 0.0005 %max
Total metallic elements : 0.05%max
Recrystallization : 95%min
Grain size : ASTM 4 or finer
Surface finish: 32Rms max. or Ra 0.4 ( RMS64 or better)
Flatness : 0.1mm or 0.15% max.
Tolerance : +/-0.010" on all dimensions
Size available :
- Flat tantalum targets, rectangular tantalum target):
1mm up to 12.7mm Thickness x Width up to 600mm x Length up to 1800mm (.040" to 0.50" thick x width up to 23.62" x length up to 70");
- CircularTantalum targets :
25mm up to 650mm Diameter x 3mm up to 25.4mm Thickness (1" to 25" diameter x 0.1181" to 1" thickness)
The material is available as follows :
- R05200, unalloyed tantalum, electron-beam furnace or vacuum-arc melt, or both,
- R05400, unalloyed tantalum, powder-metallurgy consolidation,
- R05255, tantalum alloy, 90 % tantalum, 10 % tungsten, electron-beam furnace or vacuum-arc melt, or both,
- R05252, tantalum alloy, 97.5 % tantalum, 2.5 % tungsten, electron-beam furnace or vacuum-arc melt, or both, and
- R05240, tantalum alloy, 60 % tantalum, 40 % nobium, electron-beam furnace or vacuum-arc melt.
Typical Size & Application: The popular geometries of tantalum sputtering target are available with both planar sputtering targets and rotatable sputtering targets, such as tantalum circular, tantalum rectangular, tantalum ring, tantalum tube, tantalum cylinder(cylindrical targets) and tantalum conicity, etc., we can meet your unique requirements on tantalum sputtering targets no matter in density, purity, homogeneity or in geometry of the sputtering target for the thin film industry.
50.8mm diameter x 3.175mm thickness ( 2" dia X .125" thk), purity 3N8
50.8mm diameter x 6.35mm thickness ( 2" dia X .250" thk), purity 3N8
101.6mm diameter x 3.175mm thickness( 4" dia X .125" thk), purity 3N8
101.6mm diameter x 6.35mm thickness ( 4" dia X .250" thk), purity 3N8
127mm diameter x 3.175mm thickness( 5" dia X .125" thk), purity 3N8
127mm diameter x 6.35mm thickness ( 5" dia X .250" thk), purity 3N8
152.4mm diameter x 3.175mm thickness( 6" dia X .125" thk), purity 3N8
152.4mm diameter x 6.35mm thickness ( 6" dia X .25" thk), purity 3N8
215.90mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 8.5" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions. Surface finish: Ra 1.6 to 0.8 micron
254mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 10" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions. Surface finish: Ra 1.6 to 0.8 micron
355.6mm(+/-0.254) diameter x 6.35mm(+/-0.254) thickness or 14" diameter x 0.25" thickness with tolerance: +/-0.010" on all dimensions.
304.80mm x 355.60mm x 6.35mm or 12" x 14" x 0.25" with tolerance: +/-0.010" on all dimensions. Surface finish: Ra 1.6 to 0.8 micron.
We can tailor the sizes upon request.
Trade name: Ta target, Ta sputtering targets, Ta targets, Ta sputtering target, Sputtering target of Ta, Flat target of tantalum, tantalum target, tantalum targets, tantalum alloy targets, tantalum tungsten alloy targets, tantalum sputtering targets, tantalum sputtering target, tantalum sputter target, tantalum sputter targets, tantalum thin film.
